• DocumentCode
    3018481
  • Title

    Calculation of equivalent parameters in CMUT 1-D theoretical model

  • Author

    Zhou, Wenchao ; Yu, Ting ; Yu, Fengqi

  • Author_Institution
    Dept. of Integrated Electron., CAS, Shenzhen
  • fYear
    2008
  • fDate
    2-5 Nov. 2008
  • Firstpage
    491
  • Lastpage
    495
  • Abstract
    It´s always difficult to model the real 3-D capacitive micromachined ultrasonic transducer (CMUT) because of the nonlinearity and filed coupling. An alternative solution is to build a 1-D equivalent model which is enough to acquire the desired behavior of CMUT. However, it´s hard to obtain the 1-D equivalent parameters of the real 3-D CMUT. This paper proposes such a theoretical model to calculate the 1-D equivalent parameters of a CMUT with circular membrane. To derive this model, a reduced-order model is used to approximate the shape of the circular membrane under the electrostatic force and fluid pressure. With the obtained pull-in voltage and natural frequency, several reasonable assumptions are made to calculate the 1-D equivalent parameters. Finally, a typical example is given for the validation of our model. The results obtained by the proposed model are compared to those by 3-D FEM simulation. The good agreements show that the 1-D equivalent parameters attained by our proposed model can be used to build a 1-D equivalent model.
  • Keywords
    capacitive sensors; electrostatics; finite element analysis; membranes; micromachining; microsensors; ultrasonic transducers; 1D CMUT theoretical model; 3-D FEM simulation; CMUT equivalent parameters calculation; capacitive micromachined ultrasonic transducer; circular membrane shape approximation; electrostatic force; finite element model; fluid pressure; reduced-order model; Biomembranes; Content addressable storage; Couplings; Electrodes; Electrostatics; Equations; Pistons; Shape; Ultrasonic transducers; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2008. IUS 2008. IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2428-3
  • Electronic_ISBN
    978-1-4244-2480-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2008.0120
  • Filename
    4803283