Title :
Stacking technology for a space constrained microsystem
Author :
Heschel, M. ; Kuhmann, J.F. ; Bouwstra, S. ; Amskov, M.
Author_Institution :
Mikroelektronic Centret, Lyngby, Denmark
Abstract :
In this paper we present a stacking technology for an integrated packaging of an intelligent transducer which is formed by a micromachined silicon transducer and an integrated circuit chip. Transducer and circuitry are stacked on top of each other with an intermediate chip in between. The bonding of the transducer and the intermediate chip is done by flip chip solder bump bonding. The bonding between the above two-layer stack and the circuit chip is done by conductive adhesive bonding combined with gold studs. We demonstrate the stacking technologies on passive test chips rather than real devices and report on technological details
Keywords :
adhesion; elemental semiconductors; flip-chip devices; gold; integrated circuit packaging; intelligent sensors; microsensors; semiconductor technology; silicon; transducers; Au; Au studs; Si; Si micromachined transducer; bonding; conductive adhesive bonding; flip chip solder bump bonding; integrated circuit chip; integrated packaging; intelligent transducer; intermediate chip; passive test chips; space constrained microsystem; stacking technology; two-layer stack; Bonding; Conductive adhesives; Flip chip; Gold; Integrated circuit packaging; Integrated circuit technology; Silicon; Space technology; Stacking; Transducers;
Conference_Titel :
Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
Conference_Location :
Heidelberg
Print_ISBN :
0-7803-4412-X
DOI :
10.1109/MEMSYS.1998.659774
