Title :
Design issues of a multi-functional intelligent thermal test die
Author :
Poppe, A. ; Farkas, G. ; Rencz, M. ; Benedek, S. ; Poh, L. ; Szekely, V. ; Torki, K. ; Mir, S. ; Courtois, B.
Author_Institution :
MicReD Ltd., Budapest, Hungary
Abstract :
Thermal characterization of IC packages and packaging technologies is becoming a key task in thermal engineering. To support this by measurements, we developed a family of thermal test chips that allows a wide range of possible applications. Our chips are based on the same basic cell that is mainly covered by dissipating resistors and also contains a frequency output temperature sensor. These basic cells are organized into arrays of different size. The arrays are designed so that larger arrays can also be built for tiling up larger package cavities. The first member of the family, TMC81, has been manufactured and measurements show that the goals aimed for at the design stage have been achieved
Keywords :
cellular arrays; integrated circuit design; integrated circuit measurement; integrated circuit packaging; temperature sensors; thermal analysis; thermal management (packaging); IC packages; array design; basic cell arrays; design issues; dissipating resistors; frequency output temperature sensor; multi-functional intelligent thermal test die; package cavities; packaging technologies; thermal characterization; thermal engineering; thermal measurements; thermal test chips; Circuit testing; Diodes; Integrated circuit packaging; Measurement standards; Resistors; Semiconductor device measurement; Size measurement; Temperature sensors; Thermal engineering; Thermal variables measurement;
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6649-2
DOI :
10.1109/STHERM.2001.915144
