Design issues of a multi-functional intelligent thermal test die

Author

Poppe, A. ; Farkas, G. ; Rencz, M. ; Benedek, S. ; Poh, L. ; Szekely, V. ; Torki, K. ; Mir, S. ; Courtois, B.

Author_Institution

MicReD Ltd., Budapest, Hungary

fYear

2001

fDate

2001

Firstpage

50

Lastpage

57

Abstract

Thermal characterization of IC packages and packaging technologies is becoming a key task in thermal engineering. To support this by measurements, we developed a family of thermal test chips that allows a wide range of possible applications. Our chips are based on the same basic cell that is mainly covered by dissipating resistors and also contains a frequency output temperature sensor. These basic cells are organized into arrays of different size. The arrays are designed so that larger arrays can also be built for tiling up larger package cavities. The first member of the family, TMC81, has been manufactured and measurements show that the goals aimed for at the design stage have been achieved

Keywords

cellular arrays; integrated circuit design; integrated circuit measurement; integrated circuit packaging; temperature sensors; thermal analysis; thermal management (packaging); IC packages; array design; basic cell arrays; design issues; dissipating resistors; frequency output temperature sensor; multi-functional intelligent thermal test die; package cavities; packaging technologies; thermal characterization; thermal engineering; thermal measurements; thermal test chips; Circuit testing; Diodes; Integrated circuit packaging; Measurement standards; Resistors; Semiconductor device measurement; Size measurement; Temperature sensors; Thermal engineering; Thermal variables measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6649-2

Type

conf

DOI

10.1109/STHERM.2001.915144

Filename

915144