Title :
Thermal-mechanical measurements and analysis of an advanced thermal interface material construction
Author :
Raiszadeh, Farhad ; Derian, Edward
Author_Institution :
INCEP Technol. Inc., San Diego, CA, USA
Abstract :
A high performance thermal-mechanical thermal interface material (TIM) construction for advanced electronic cooling applications was developed. Additionally, the thermal performance of this TIM construction was experimentally evaluated. The mechanical and thermal performance of the construction was also computationally analyzed. Superior performance of this construction as compared with other material in a fixed reference application was shown. The advantage of this construction in applications with nonuniform heat flux was also demonstrated. The results of the measurements and analysis illustrate that the performance of this TIM construction is superior as compared to the current state of the art in TIM materials
Keywords :
cooling; integrated circuit measurement; integrated circuit packaging; integrated circuit reliability; temperature distribution; thermal management (packaging); TIM construction; computational analysis; electronic cooling applications; fixed reference application; mechanical performance; nonuniform heat flux; thermal interface material construction; thermal performance; thermal-mechanical analysis; thermal-mechanical measurements; thermal-mechanical thermal interface material; Aggregates; Building materials; Heating; Mechanical factors; Mechanical variables measurement; Microprocessors; Performance analysis; Testing; Thermal conductivity; Thermal management;
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6649-2
DOI :
10.1109/STHERM.2001.915147
