Thermal-mechanical measurements and analysis of an advanced thermal interface material construction

Author

Raiszadeh, Farhad ; Derian, Edward

Author_Institution

INCEP Technol. Inc., San Diego, CA, USA

fYear

2001

fDate

2001

Firstpage

63

Lastpage

70

Abstract

A high performance thermal-mechanical thermal interface material (TIM) construction for advanced electronic cooling applications was developed. Additionally, the thermal performance of this TIM construction was experimentally evaluated. The mechanical and thermal performance of the construction was also computationally analyzed. Superior performance of this construction as compared with other material in a fixed reference application was shown. The advantage of this construction in applications with nonuniform heat flux was also demonstrated. The results of the measurements and analysis illustrate that the performance of this TIM construction is superior as compared to the current state of the art in TIM materials

Keywords

cooling; integrated circuit measurement; integrated circuit packaging; integrated circuit reliability; temperature distribution; thermal management (packaging); TIM construction; computational analysis; electronic cooling applications; fixed reference application; mechanical performance; nonuniform heat flux; thermal interface material construction; thermal performance; thermal-mechanical analysis; thermal-mechanical measurements; thermal-mechanical thermal interface material; Aggregates; Building materials; Heating; Mechanical factors; Mechanical variables measurement; Microprocessors; Performance analysis; Testing; Thermal conductivity; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6649-2

Type

conf

DOI

10.1109/STHERM.2001.915147

Filename

915147