Title :
Development of scratch resistance SiO2 nanocomposite coating for teak wood
Author :
Kanokwijitsilp, Thananthorn ; Osotchan, Tanakorn ; Srikhirin, Toemsak
Author_Institution :
Mater. Sci. & Eng. Program, Mahidol Univ., Bangkok, Thailand
Abstract :
Teak wood is widely used for the housing interior and decoration because of its beautiful grains appearance; however, it often suffers from surface damage especially in the tiling application. The remedy is to apply a protective layer such as polyurethane (PU). In this work, the sol-gel inorganic reinforced hard coating formulation based on silicon dioxide (SiO2) nanoparticles (SNPs) and methyltrimethoxysilane (MTMS) was investigated as a protective layer for teak wood. The coating formulation was applied by brushing, followed by pre-cured at 65 °C for 1 hr and cured at 95 °C for 3 hrs, yielding a transparent nanocomposite film. The SiO2 nanocomposite coating showed an improvement in abrasion resistance property, tested with Taber abrasion at 5 N for 1000 cycles, as evidenced by a lower weight loss than an uncoated counterpart. The nanocomposite film also showed a higher wear through resistance than the commercial PU coating. Water can be easily absorbed by uncoated wood while the nanocomposite coated wood showed an improvement in water resistance as evidence by water contact angle. The cross-sectional image showed that the nanocomposite film and the wood surface were forming a physical interlocking.
Keywords :
abrasion; curing; nanocomposites; silicon compounds; sol-gel processing; wear resistance; wear resistant coatings; wood; SO2; Taber abrasion; abrasion resistance; brushing; decoration; housing interior; methyltrimethoxysilane; nanocomposite coatings; polyurethane; precuring; protective coatings; scratch resistance; silicon dioxide nanoparticles; sol-gel inorganic reinforced hard coating formulation; teak wood; water contact angle; water resistance; Coatings; Educational institutions; Films; Surface resistance; Surface treatment;
Conference_Titel :
Nanotechnology (IEEE-NANO), 2013 13th IEEE Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-0675-8
DOI :
10.1109/NANO.2013.6721025