DocumentCode
3019291
Title
The European project PROFIT: prediction of temperature gradients influencing the quality of electronic products
Author
Lasance, Clemens J M
Author_Institution
Philips Res. Lab., Eindhoven, Netherlands
fYear
2001
fDate
2001
Firstpage
120
Lastpage
125
Abstract
As the thermal community in Europe is relatively small compared to the US, research in this field is rather fragmented. Funding by the European Community (EC) makes a substantial impact in terms of helping to aggregate this fragmentation and build the critical mass necessary to realise a sound research program. On January 1, 2000, a new European project, called PROFIT, commenced as a kind of successor to the successfully finished EC-funded DELPHI, SEED and THERMINIC projects. PROFIT is aimed at creating methods and tools that enable sufficiently accurate measurement and prediction of temperature gradients in time and space, which is required for a more accurate and timely assessment of cost, performance, safety and reliability of electronic products in all stages of the product realisation process. This paper discusses its motivation, scope, objectives, advances over the state-of-the-art and the results achieved in 2000
Keywords
quality control; reliability; research initiatives; safety; temperature distribution; temperature measurement; thermal management (packaging); EC-funded DELPHI project; EC-funded SEED project; EC-funded THERMINIC project; European Community funding; European PROFIT project; cost assessment; electronic product quality; electronic products; performance assessment; product realisation process; reliability; research program; safety; temperature gradient measurement; temperature gradient prediction; Consumer electronics; Costs; Electronic equipment testing; Electronic packaging thermal management; Electrons; Life testing; Temperature; Thermal management; Thermal management of electronics; Virtual prototyping;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium
Conference_Location
San Jose, CA
Print_ISBN
0-7803-6649-2
Type
conf
DOI
10.1109/STHERM.2001.915160
Filename
915160
Link To Document