DocumentCode
3019326
Title
Creating compact models using standard spreadsheet software
Author
Noebauer, Gerhard
Author_Institution
Infineon Technol., Munich, Germany
fYear
2001
fDate
2001
Firstpage
126
Lastpage
133
Abstract
Methods are proposed for the determination of boundary conditions independent (BCI) compact thermal models. These flexible techniques can be utilized in combination with the input/output capabilities and standard functions of common spreadsheet programs, which are particularly useful in the process of error minimization. First, the steady-state is considered where resistor models are applicable. On a fast time scale, one-dimensional Cauer resistor-capacitor networks are sufficient to model transient behavior. This paper presents a way to obtain analytical solutions for RC ladders of arbitrary size. The method also eases network conversion. The steady-state and short-time behavior is used as basis information for derivation of BCI transient models. A numerical integration technique applicable to any network is outlined. The proposed techniques are used within the process of development of a transient BCI model for Infineon´s BTS840S2 dual chip device, assembled in a P-DSO-20-10 package, which predicts the junction temperatures for any switching state
Keywords
RC circuits; circuit analysis computing; error analysis; integrated circuit modelling; integrated circuit packaging; integration; minimisation; multichip modules; spreadsheet programs; thermal analysis; thermal management (packaging); transient analysis; 1D Cauer resistor-capacitor networks; BCI compact thermal models; BCI transient models; Infineon BTS840S2 dual chip device; P-DSO-20-10 package assembly; RC ladders; boundary conditions independent compact thermal models; compact models; error minimization; flexible techniques; input/output capabilities; junction temperatures; network conversion; numerical integration technique; resistor models; short-time behavior; spreadsheet programs; standard functions; standard spreadsheet software; steady-state behavior; switching state; transient BCI model; transient behavior model; Boundary conditions; Cost function; Integrated circuit modeling; Packaging; Predictive models; Resistors; Software standards; Steady-state; Temperature distribution; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium
Conference_Location
San Jose, CA
Print_ISBN
0-7803-6649-2
Type
conf
DOI
10.1109/STHERM.2001.915161
Filename
915161
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