• DocumentCode
    3019451
  • Title

    Design and measurement of MEMS capacitive ultrasonic transducer

  • Author

    Jing Miao ; Wenjiang Shen ; Muyu Chen ; Hui Wang ; Changde He ; Chenyang Xue ; Jijun Xiong

  • Author_Institution
    Nat. Key Lab. for Electron. Meas. Technol., North Univ. of China, Taiyuan, China
  • fYear
    2015
  • fDate
    7-11 April 2015
  • Firstpage
    602
  • Lastpage
    604
  • Abstract
    Since the proposing of capacitive micromachined ultrasonic transducer by Khuri Yakub group in 1994 that this kind of transducer occupying the advantages of wide bandwidth, impedance matching well with the propagation medium especially in fluid and air and high sensitivity, has shown a great potential for a wide range of applications such as medical imaging, medical ultrasound diagnosis, therapy and underwater ultrasonic imaging. This paper presents a kind of MEMS capacitive ultrasonic transducer with the novel cavities embedded in the device layer of Silicon On Insulator. Firstly, the geometric dimensions are derived from the theoretical analysis of the vibrating membrane and the electrical analysis of the transducer. Secondly, Finite Element Analysis is adopted to confirm the operation mode and the deflection and equivalent stress under operation/collapse voltage are obtained. Then, the fabrication process is depicted and the fabricated transducer is shown. The test results show that the electromechanical coupling coefficient is 69.65%.
  • Keywords
    capacitive transducers; finite element analysis; microsensors; silicon-on-insulator; ultrasonic transducers; MEMS capacitive ultrasonic transducer; capacitive micromachined ultrasonic transducer; deflection; electrical analysis; electromechanical coupling coefficient; equivalent stress; fabrication process; finite element analysis; geometric dimensions; operation mode; propagation medium; silicon on insulator; vibrating membrane; Acoustics; Cavity resonators; Electrodes; Micromechanical devices; Resonant frequency; Transducers; Ultrasonic transducers; Capacitive Ultrasonic Transducer; FEA; MEMS; SOI; embedded cavities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2015 IEEE 10th International Conference on
  • Conference_Location
    Xi´an
  • Type

    conf

  • DOI
    10.1109/NEMS.2015.7147501
  • Filename
    7147501