DocumentCode
3019530
Title
Model-based dynamic characteristics investigation of ultrasonic transducers for MEMS packaging
Author
Wang, Fujun ; Zhao, Xingyu ; Zhang, Dawei ; Wu, Yimin
Author_Institution
Sch. of Mech. Eng., Tianjin Univ., Tianjin
fYear
2008
fDate
2-5 Nov. 2008
Firstpage
2138
Lastpage
2141
Abstract
To provide faster, more repeatable and stronger MEMS packaging technology, the dynamic characteristics of ultrasonic transducers are studied using finite element method (FEM), and the ultrasonic generator for driving the transducer is also presented in this paper. The finite element model of the high frequency ultrasonic transducer was established by using ANSYS software, and the vibration characteristics of the transducer in free and constrained states were analyzed, respectively. The vibration modes of the transducer were gained through modal analysis. The steady and transient responses were figured out using harmonic and transient analysis, respectively. The ultrasonic generator with phase loop lock (PLL) was designed on the basis of complex programmable logic device (CPLD). Laser Doppler measurements were carried out to investigate the dynamic characteristics of the transducer, and the experiment results are in good agreement with the FEM results. The characteristics of the ultrasonic generator were examined, and the results show that it has good performance, and thus the ultrasonic transducer system can fulfill finer packaging.
Keywords
Doppler measurement; electronics packaging; finite element analysis; harmonic analysis; measurement by laser beam; micromechanical devices; modal analysis; phase locked loops; programmable logic devices; transient analysis; ultrasonic transducers; vibrations; ANSYS software; CPLD; FEM; MEMS packaging technology; PLL; complex programmable logic device; constrained state; dynamic characteristics; finite element method; harmonic analysis; high frequency ultrasonic transducer system; laser Doppler measurement; modal analysis; phase loop lock design; steady response; transient analysis; transient response; ultrasonic generator; vibration mode characteristics; Character generation; Finite element methods; Frequency; Micromechanical devices; Modal analysis; Packaging; Phase locked loops; Programmable logic devices; Transient analysis; Ultrasonic transducers; MEMS packaging; dynamic analysis; ultrasonic generator; ultrasonic transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location
Beijing
Print_ISBN
978-1-4244-2428-3
Electronic_ISBN
978-1-4244-2480-1
Type
conf
DOI
10.1109/ULTSYM.2008.0529
Filename
4803325
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