• DocumentCode
    3019855
  • Title

    Analysis of manifold fluid flow networks for air and liquid flow-through modular electronics

  • Author

    Johnso, Scott T.

  • Author_Institution
    Raytheon Sensors & Electron. Syst. Co., El Segundo, CA, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    233
  • Lastpage
    244
  • Abstract
    Manifold fluid flow networks are an essential element in cooling systems that distribute forced air or forced liquid cooling to high performance modular electronics. Manifolds represent a specialized design problem, however, and few engineers in the field electronics thermal management are familiar with the basic fluid dynamics concepts that govern flow rate and pressure distribution in manifold systems. The subject paper describes a one dimensional discrete branch point model for manifold analysis. Predicted results are compared with liquid flow test data in the laminar and transitional regimes. CFD simulations are used to assess the validity of selected empirical coefficients. Basic design guidelines for the practicing engineer are provided
  • Keywords
    computational fluid dynamics; cooling; design engineering; flow simulation; laminar flow; military equipment; military systems; modules; thermal analysis; thermal management (packaging); 1D discrete branch point model; CFD simulations; air flow-through modular electronics; cooling systems; design guidelines; field electronics thermal management; flow rate; fluid dynamics; forced air cooling; forced liquid cooling; laminar regime; liquid flow test data; liquid flow-through modular electronics; manifold analysis; manifold design; manifold fluid flow networks; manifold systems; military electronics packaging; modular electronics; pressure distribution; transitional regime; Design engineering; Electronics cooling; Engineering management; Fluid dynamics; Fluid flow; Liquid cooling; Manifolds; Thermal engineering; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7803-6649-2
  • Type

    conf

  • DOI
    10.1109/STHERM.2001.915184
  • Filename
    915184