DocumentCode
3019869
Title
Temperature sensors placement strategy for fault diagnosis in integrated circuits
Author
Bratek, Piotr ; Kos, Andrzej
Author_Institution
Inst. of Electron., Univ. of Min. & Metall., Kracow, Poland
fYear
2001
fDate
2001
Firstpage
245
Lastpage
251
Abstract
In this paper, we present a new temperature sensor placement strategy. This placement method is proposed for fault diagnosis in integrated circuits (ICs). Simulation results of the new concept sensor placement strategy are presented. Statistical analyses of the yield of this testing method are shown
Keywords
circuit simulation; failure analysis; fault diagnosis; integrated circuit layout; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; integrated circuit yield; statistical analysis; temperature distribution; temperature sensors; thermal analysis; fault diagnosis; integrated circuits; sensor placement method; sensor placement strategy; simulation; statistical analysis; temperature sensor placement strategy; test yield; testing method; Circuit simulation; Circuit testing; Electronic mail; Fault diagnosis; Multichip modules; Silicon; Statistical analysis; Temperature sensors; Thermal conductivity; Thermal sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium
Conference_Location
San Jose, CA
Print_ISBN
0-7803-6649-2
Type
conf
DOI
10.1109/STHERM.2001.915185
Filename
915185
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