DocumentCode :
3019900
Title :
Dynamic measurement techniques of contact pressure using piezoelectric PVDF film
Author :
Li Junfeng ; Su Xiuping ; Li Shengli ; Huang Shaowei
Author_Institution :
Province-Minist. Joint Key Lab. of Electromagn., Field & Electr. ApparatusReliability, Hebei Univ. of Technol., Tianjin, China
fYear :
2013
fDate :
20-22 Dec. 2013
Firstpage :
387
Lastpage :
390
Abstract :
The main purpose of this paper is to obtain the dynamic behavior of contact pressure on contacts using polyvinylidene fluoride (PVDF) piezoelectric film. Based on the pressure measurement principle of PVDF piezoelectric film, an AC contactor contact pressure sensor was developed whose sensitive elements were made of PVDF. The sensor´s output was connected to a charge amplifier via shielding line to get voltage signal, which was proportionate to the contact pressure, and thus whose dynamic behavior was obtained. A distinct dynamic behavior of contact pressure was got from a dynamic testing on CJ20-25. The voltage waveform reflects the dynamic variation trend of the contacts contact pressure. It also indicates the changes of the peak contact pressure and contact bounce under different close phase angle. Previous AC contactor dynamic characteristics test system does not have this function. Finally the influence factors of sensitivity were discussed.
Keywords :
amplifiers; dynamic testing; electrical contacts; piezoelectric thin films; piezoelectric transducers; polymer films; pressure measurement; pressure sensors; thin film sensors; AC contactor contact pressure sensor; CJ20-25 dynamic testing; charge amplifier; contact pressure measurement; piezoelectric PVDF film; polyvinylidene fluoride; shielding line; voltage waveform signal; Computers; Contacts; Data acquisition; Educational institutions; Piezoelectric films; Pressure measurement; Testing; AC contactor; PVDF piezoelectric film; contact pressure; dynamic Measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Mechatronic Sciences, Electric Engineering and Computer (MEC), Proceedings 2013 International Conference on
Conference_Location :
Shengyang
Print_ISBN :
978-1-4799-2564-3
Type :
conf
DOI :
10.1109/MEC.2013.6885101
Filename :
6885101
Link To Document :
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