DocumentCode
3020138
Title
Tuning of resistance of nanogaps using field-emission-induced electromigration with feedback control scheme
Author
Ando, Makoto ; Akimoto, S. ; Suda, Ryutaro ; Shirakashi, Jun-ichi
Author_Institution
Dept. of Electr. & Electron. Eng., Tokyo Univ. of Agric. & Technol., Koganei, Japan
fYear
2013
fDate
5-8 Aug. 2013
Firstpage
1141
Lastpage
1144
Abstract
We report a newly investigated technique for the tuning of tunnel resistance of nanogaps using electromigration phenomena induced by a field emission current, which is called “activation” method. First, Planar-type initial nanogaps of Ni separated by 20-50 nm were defined on SiO2/Si substrates. Then, a bias current was applied to the initial Ni nanogaps at room temperature using a current source. Here, we propose a feedback approach during activation procedures, in order to precisely control the resistance of nanogaps at room temperature. We call this method “feedback-controlled activation (FCA)”, and it is revealed that control characteristics of tunnel resistance of nanogaps are successfully improved using FCA procedure, as compared with conventional activation without feedback scheme. These results indicate that a feedback approach is useful for the stable control of tunnel resistance of nanogaps using activation method.
Keywords
electromigration; energy gap; feedback; field emission; nanostructured materials; FCA procedure; Ni separation; SiO2-Si substrates; SiO2-Si; activation method; activation procedure; bias current; current source; feedback control scheme; feedback-controlled activation; field emission current; field-emission-induced electromigration; initial Ni nanogaps; nanogap resistance control; nanogap resistance tuning; planar-type initial nanogaps; size 20 nm to 50 nm; temperature 293 K to 298 K; tunnel resistance control; tunnel resistance tuning; Electrodes; Electromigration; Histograms; Junctions; Nickel; Resistance; Tuning;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology (IEEE-NANO), 2013 13th IEEE Conference on
Conference_Location
Beijing
ISSN
1944-9399
Print_ISBN
978-1-4799-0675-8
Type
conf
DOI
10.1109/NANO.2013.6721060
Filename
6721060
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