DocumentCode :
3020294
Title :
The design and characterization of capacitive micromachined ultrasonic transducers (CMUTs) for generating high-intensity ultrasound for transmission of directional audio
Author :
Wygant, Ira O. ; Kupnik, Mario ; Khuri-Yakub, Butrus T. ; Wochner, Mark S. ; Wright, Wayne M. ; Hamilton, Mark F.
Author_Institution :
Nat. Semicond. Labs., Nat. Semicond., Santa Clara, CA
fYear :
2008
fDate :
2-5 Nov. 2008
Firstpage :
2100
Lastpage :
2102
Abstract :
A directional source of audio sound created using a parametric array, sometimes called an audio spotlight, generates a sound beam that is much narrower than the sound beam generated by a conventional source. These directional sources require the transmission of a modulated high-intensity ultrasonic carrier wave. Capacitive transducers are well-suited for parametric array audio applications because they can efficiently generate high-intensity ultrasound with a relatively wide bandwidth. CMUTs with vacuum-sealed cavities are particularly advantageous because they lack squeeze-film damping, which increases bandwidth but reduces displacement, and because their sealed cavities and permanently attached membranes make them relatively robust. In this paper, we present the basic design constraints of CMUTs intended to generate low-frequency high-intensity airborne ultrasound. In addition, we describe a new method for fabricating these CMUTs that results in uniform cavity depths and a thick insulating oxide layer. Measurement of a fabricated device´s input impedance and small-signal displacement demonstrates the success of the new fabrication method and shows good agreement with theory.
Keywords :
acoustic arrays; acoustic parametric devices; audio equipment; capacitive sensors; micromachining; ultrasonic transducers; CMUT design; audio spotlight; capacitive micromachined ultrasonic transducers; directional audio sound transmission source; high-intensity airborne ultrasound generation; high-intensity ultrasonic carrier wave; parametric array; small-signal displacement; thick insulating oxide layer; uniform cavity depth; vacuum-sealed cavities; Acoustic transducers; Bandwidth; Biomembranes; Character generation; Damping; Insulation; Robustness; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2428-3
Electronic_ISBN :
978-1-4244-2480-1
Type :
conf
DOI :
10.1109/ULTSYM.2008.0519
Filename :
4803359
Link To Document :
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