• DocumentCode
    3020988
  • Title

    Using the boundary scan delay chain for cross-chip delay measurement and characterization of delay modeling flow

  • Author

    Schmid, Josef ; Schuring, Timo ; Smalla, Christoph

  • Author_Institution
    Lucent Technol. Network Syst., Nuremberg, Germany
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    337
  • Lastpage
    342
  • Abstract
    For ASICs/SOCs/lCs it is often very important to have an easily accessible delay measurements path for several reasons. The delay of a long path running across the whole chip through lots of instances (inverters, MUXes) makes it possible to measure the final process parameters of an ASIC/IC within the best and worst case production process window. This information is very important for production testing and assembly at the vendor site. But very often this information is also necessary at circuit pack level, system test level and even in the field - when in the case of problems (functionality, timing, debugging) it should be known which “quality level” the ASIC/IC device has reached. Also for characterization of the delay modeling during the different design phases (estimation, floorplanning, trial and final layout) such a dedicated delay path may help in qualifying the delay models. We propose to use a new standard methodology to address these issues by definition of a dedicated delay path. It is called “Boundary Scan Delay Chain” (BSDC). We use the Boundary Scan data register according to IEEE1149.1 to get a delay chain across the chip. Only a slight modification of the boundary scan cell (e.g. BC 1, BC 4) is necessary. The resulting new functionality still conforms to IEEE1149.1
  • Keywords
    application specific integrated circuits; automatic testing; boundary scan testing; delay estimation; integrated circuit testing; logic testing; production testing; quality control; ASICs; IEEE1149.1; SOCs; boundary scan cell; boundary scan delay chain; circuit pack level; cross-chip delay measurement; delay measurements path; delay modeling flow; design phases; estimation; final process parameters; floorplanning; production process window; production testing; quality level; system test level; Application specific integrated circuits; Assembly; Circuit testing; Delay estimation; Integrated circuit testing; Inverters; Production; Semiconductor device measurement; System testing; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2001 International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7695-1025-6
  • Type

    conf

  • DOI
    10.1109/ISQED.2001.915253
  • Filename
    915253