• DocumentCode
    3021390
  • Title

    Study on the Properties of Sound Isolation for Acoustic Band Gaps Materials with Tandem Structure

  • Author

    Huanyu, Zhao ; Cunfu, He ; Ruiju, Wei ; Bin, Wu ; Guorong, Song

  • Author_Institution
    Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China
  • fYear
    2010
  • fDate
    25-27 June 2010
  • Firstpage
    2174
  • Lastpage
    2176
  • Abstract
    The properties of band-gaps for two-dimensional phononic crystals consisting of stainless steel cylinders in air background with square lattice, triangular lattice and honey-comb lattice are investigated theoretically by the plane wave expansion (PWE) method, respectively. The lattice structures play the key role in determining existence of band gaps. According to the width and position of band gaps and directions of lattices, we have designed a new type of acoustic band-gap materials with a tandem structure of three kinds of lattice structures and obtained the ultrawide band gaps within the human audible range of frequencies. So this composites with a tandem structure can stop effectively the effect of environmental noise as noise barriers.
  • Keywords
    acoustic materials; acoustic wave absorption; energy gap; honeycomb structures; noise abatement; stainless steel; 2D phononic crystals; PWE method; acoustic band gap materials; air background; band gap position; band gap width; environmental noise effects; honeycomb lattice; lattice direction; noise barriers; plane wave expansion method; sound isolation; square lattice; stainless steel cylinders; tandem structure; triangular lattice; Acoustics; Crystals; Lattices; Mechanical factors; Noise; Photonic band gap; acoustic band-gap materials; band gaps; sound isolation; tandem structure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Control Engineering (ICECE), 2010 International Conference on
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4244-6880-5
  • Type

    conf

  • DOI
    10.1109/iCECE.2010.535
  • Filename
    5631971