DocumentCode
3021420
Title
Spice model quality: process development viewpoint
Author
Bendix, Peter
fYear
2001
fDate
2001
Firstpage
477
Lastpage
481
Abstract
The author shows what is required of a good model, with emphasis from a process development point of view. The merits of good test chips, physical correctness of the model, and realistic skews (best/worst case) are investigated. Prediction of future technologies with some level of confidence is also looked at. A close working relationship between process integration, model engineering, and circuit design is considered. Advantages of models with well-behaved, smooth, glitchless characteristics and well-behaved derivatives are covered. Parameter correlations, parameter redundancy and model documentation round out the basic model discussions. Extra features are also covered including noise models, high frequency characterization, diode models, parasitic bipolar models, etc. and finally, the need for models to evolve with manufacturing
Keywords
MOSFET; SPICE; redundancy; semiconductor device models; semiconductor device noise; semiconductor diodes; HF characterization; MOS devices; Spice model quality; circuit design; diode models; glitchless characteristics; high frequency characterization; model documentation; model engineering; noise models; parameter correlations; parameter redundancy; parasitic bipolar models; process development viewpoint; process integration; technologies prediction; Circuit noise; Circuit synthesis; Circuit testing; Design engineering; Diodes; Frequency; Large scale integration; Logic; SPICE; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2001 International Symposium on
Conference_Location
San Jose, CA
Print_ISBN
0-7695-1025-6
Type
conf
DOI
10.1109/ISQED.2001.915274
Filename
915274
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