• DocumentCode
    3021420
  • Title

    Spice model quality: process development viewpoint

  • Author

    Bendix, Peter

  • fYear
    2001
  • fDate
    2001
  • Firstpage
    477
  • Lastpage
    481
  • Abstract
    The author shows what is required of a good model, with emphasis from a process development point of view. The merits of good test chips, physical correctness of the model, and realistic skews (best/worst case) are investigated. Prediction of future technologies with some level of confidence is also looked at. A close working relationship between process integration, model engineering, and circuit design is considered. Advantages of models with well-behaved, smooth, glitchless characteristics and well-behaved derivatives are covered. Parameter correlations, parameter redundancy and model documentation round out the basic model discussions. Extra features are also covered including noise models, high frequency characterization, diode models, parasitic bipolar models, etc. and finally, the need for models to evolve with manufacturing
  • Keywords
    MOSFET; SPICE; redundancy; semiconductor device models; semiconductor device noise; semiconductor diodes; HF characterization; MOS devices; Spice model quality; circuit design; diode models; glitchless characteristics; high frequency characterization; model documentation; model engineering; noise models; parameter correlations; parameter redundancy; parasitic bipolar models; process development viewpoint; process integration; technologies prediction; Circuit noise; Circuit synthesis; Circuit testing; Design engineering; Diodes; Frequency; Large scale integration; Logic; SPICE; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2001 International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7695-1025-6
  • Type

    conf

  • DOI
    10.1109/ISQED.2001.915274
  • Filename
    915274