Title :
Ultrasound energy harvesting system for deep implanted-medical-devices (IMDs)
Author :
Mazzilli, Francesco ; Thoppay, Prakash E. ; Praplan, Vincent ; Dehollain, Catherine
Author_Institution :
RFIC Group, Ecole Polytech. Fed. de Lausanne, Lausanne, Switzerland
Abstract :
It is desirable in active medical implants to derive energy from external sources to charge a rechargeable battery. In this paper we have developed a novel system to transfer energy via ultrasound to a deep implanted medical device. Hence, an external base station is designed to transmitt energy and a 64-channel high-voltage driver is proposed for a spherical transducer array. Moreover, a shunt-C class-E power amplifier (PA) is employed as core element for the driver, showing a drain efficiency (DE) of 71% and a power added efficiency (PAE) of 57% including gate-driver switching loss. In addition, a cascaded of two low-drop-out (LDO) regulators is used within the implanted device to reduce rectifier ripple and to set the charge voltage for the micro-energy cell to 4.1 V. The LDOs are implemented in a CMOS 0.18 μm high-voltage (HV) technology and measurement along with simulated results are reported.
Keywords :
CMOS integrated circuits; biomedical transducers; energy harvesting; power amplifiers; prosthetics; rectifying circuits; secondary cells; voltage control; 64-channel high-voltage driver; CMOS high-voltage technology; active medical implants; charge voltage; deep implanted-medical-devices; efficiency 57 percent; efficiency 71 percent; external base station; gate-driver switching loss; low-drop-out regulators; microenergy cell; rechargeable battery; rectifier ripple; shunt-C class-E power amplifier; size 0.18 mum; spherical transducer array; ultrasound energy harvesting system; voltage 4.1 V; Arrays; Batteries; Implants; Transducers; Tuning; Ultrasonic imaging; Zero voltage switching; CMOS; energy harvesting; healthcare; implanted medical device; power management; sensor networks;
Conference_Titel :
Circuits and Systems (ISCAS), 2012 IEEE International Symposium on
Conference_Location :
Seoul
Print_ISBN :
978-1-4673-0218-0
DOI :
10.1109/ISCAS.2012.6271911
