Title :
Growth study of AlN on amorphous films with defined roughness
Author :
Artieda, Alvaro ; Muralt, Paul
Author_Institution :
Ceramics Lab., Ecole Polytech. Fed. de Lausanne, Lausanne
Abstract :
(001)-textured AlN thin films as needed for longitudinal bulk acoustic wave (BAW) devices exhibit large mechanical stress variations and large orientation variation as a function of growth substrate properties. We prepared thin silicon and silicon dioxide layers by sputter deposition to increase the roughness of thermal oxide films. The amorphous silicon films exhibited an rms roughness of 0.1 to 1.1 nm and the amorphous SiO2 an rms roughness ranging from 0.2 to 3.8 nm. In the following we studied stress, orientation, and rocking curve width of AlN films grown on these substrates. Mechanical stress varied from -700 to + 350 MPa and X-ray rocking curve width of AlN increased from 1.3 to 4.5 deg with increasing roughness. The effect of substrate RF bias during AlN deposition was studied as well. The piezoelectric d33,f coefficient varied together with the rocking curve width and the mechanical stress. Optimal conditions so far identified yielded a d33,f of 4.2 pm/V in case of a 1.2 mum piezoelectric AlN film grown on a amorphous sputtered SiO2 layer.
Keywords :
III-V semiconductors; aluminium compounds; amorphous semiconductors; bulk acoustic wave devices; elemental semiconductors; piezoelectric devices; piezoelectric thin films; semiconductor growth; semiconductor thin films; silicon; silicon compounds; sputter deposition; stress analysis; surface roughness; wide band gap semiconductors; AlN-Si; AlN-SiO2; X-ray rocking curve; amorphous films; longitudinal bulk acoustic wave devices; mechanical stress; piezoelectric coefficient; piezoelectric film; rms roughness; silicon dioxide layers; sputter deposition; substrate RF bias; thermal oxide film roughness; thin film growth; thin silicon layers; Acoustic waves; Amorphous materials; Mechanical factors; Piezoelectric films; Semiconductor films; Silicon; Sputtering; Stress; Substrates; Thin film devices; Aluminum Nitride; Sputtering; Substrate roughness; TFBAR; component;
Conference_Titel :
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2428-3
Electronic_ISBN :
978-1-4244-2480-1
DOI :
10.1109/ULTSYM.2008.0219