DocumentCode :
3022061
Title :
Block-level fault isolation using partition theory and logic minimization techniques
Author :
Shi, C. J Richard
Author_Institution :
Dept. of Electr. & Comput. Eng., Iowa Univ., Iowa City, IA, USA
fYear :
1997
fDate :
28-31 Jan 1997
Firstpage :
319
Lastpage :
324
Abstract :
Multichip modules are emerging as a key packaging technology for mixed-signal circuits and systems. In this paper, we consider how to localize a failure within a chip boundary as rapidly as possible in order to expedite the rework process and to minimize its overall impact on manufacturing throughput and cycle time. A key contribution of this paper is to provide a unified block-level fault isolation framework for analog and digital circuits, and to show that optimum fault isolation reduces to set covering. This allows us to apply directly powerful set covering techniques and solvers developed recently in logic minimization. In addition, we present a greedy peeling heuristic with performance bound computation. Some preliminary experimental results are included to demonstrate the feasibility and performance of the proposed approach
Keywords :
fault location; logic design; minimisation of switching nets; multichip modules; packaging; block-level fault isolation; chip boundary; cycle time; fault isolation framework; greedy peeling heuristic; logic minimization techniques; manufacturing throughput; mixed-signal circuits; multichip modules; optimum fault isolation; packaging technology; partition theory; rework process; set covering; Circuit faults; Circuits and systems; Digital circuits; Isolation technology; Logic; Manufacturing processes; Multichip modules; Packaging; Pulp manufacturing; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 1997. Proceedings of the ASP-DAC '97 Asia and South Pacific
Conference_Location :
Chiba
Print_ISBN :
0-7803-3662-3
Type :
conf
DOI :
10.1109/ASPDAC.1997.600169
Filename :
600169
Link To Document :
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