DocumentCode
3022393
Title
Piezocomposite and CMUT arrays assessment through in vitro imaging performances
Author
Legros, M. ; Meynier, C. ; Dufait, R. ; Férin, G. ; Tranquart, F.
Author_Institution
Vermon SA, Tours
fYear
2008
fDate
2-5 Nov. 2008
Firstpage
1142
Lastpage
1145
Abstract
Piezoelectric and capacitive micromachined ultrasound transducers (CMUT) are usually measured and compared in regards to acoustic and electro-acoustic performances. This paper is focused on the imaging performances of such transducers and propose a quantitative imaging assessment of B-mode images. In this purpose, fully integrated CMUT and piezocomposite-based probes were manufactured. Transducers were designed with close features (geometries, center frequency, interconnect and packaging) and plug on a clinical ultrasound system with a research interface. Major imaging performances (speckle to noise ratio, resolutions and contrast) of the probes are presented. Despite an environment dedicated to piezoelectric transducers, CMUT probe exhibits comparable image quality as compared to a state-of-the-art piezocomposite probe. Indeed, close resolutions are calculated, field of view is improved in phased-array imaging, and contrast is significantly improved.
Keywords
biomedical transducers; biomedical ultrasonics; capacitive sensors; image resolution; piezoelectric transducers; ultrasonic transducer arrays; B-mode image; CMUT array assessment; capacitive micromachined ultrasound transducer; clinical ultrasound system; electro-acoustic performance; image resolution; in vitro imaging; phased-array imaging; piezocomposite array assessment; piezoelectric transducer; quantitative imaging assessment; speckle-to-noise ratio; Acoustic imaging; Acoustic measurements; Acoustic transducers; Image resolution; In vitro; Piezoelectric transducers; Probes; Ultrasonic imaging; Ultrasonic transducers; Ultrasonic variables measurement; CMUT; Quantitative image assessment; piezocomposite based transducer;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location
Beijing
Print_ISBN
978-1-4244-2428-3
Electronic_ISBN
978-1-4244-2480-1
Type
conf
DOI
10.1109/ULTSYM.2008.0275
Filename
4803447
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