DocumentCode :
3022931
Title :
Placement effect of MEMS thermoelectric generator to harvest waste heat using shunt configuration for microprocessor
Author :
Tai Zhi Ling ; Ong Hang See
Author_Institution :
Asia R&D Software & Firmware Dev., Western Digital Malaysia, Petaling Jaya, Malaysia
fYear :
2012
fDate :
19-21 Sept. 2012
Firstpage :
10
Lastpage :
13
Abstract :
Using the waste heat generated by the microprocessor is a prospect to improve the total energy efficiency of a microprocessor system. There is a need for an optimal design to harvest waste heat efficiently. This study investigated the effect of the placement of the TEG on the total energy harvested. The heat dissipation performance of the microprocessor relative to the placement of the TEG is also investigated. To evaluate the placement effect, the system is subjected to a non-uniform temperature analysis using numerical method. The thermoelectric energy conversion equations were derived from Seebeck effect. The simulation evaluates two types of heat spreader material, copper and pyrolytic graphite. The advantages and their shortfalls are discussed in the results.
Keywords :
cooling; copper; energy harvesting; graphite; micromechanical devices; microprocessor chips; numerical analysis; thermoelectric conversion; thermoelectric devices; waste heat; MEMS thermoelectric generator; Seebeck effect; TEG placement; energy efficiency; heat dissipation performance; heat spreader material; microprocessor system; nonuniform temperature analysis; numerical method; optimal design; placement effect; pyrolytic graphite; shunt configuration; thermoelectric energy conversion equation; total energy harvesting; waste heat harvesting; Copper; Graphite; Heat sinks; Heating; Mathematical model; Microprocessors; Waste heat; Energy harvesting; MEMS Thermoelectric; Microprocessor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4673-2395-6
Electronic_ISBN :
978-1-4673-2394-9
Type :
conf
DOI :
10.1109/SMElec.2012.6417079
Filename :
6417079
Link To Document :
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