• DocumentCode
    3023016
  • Title

    Hierarchical fault tracing for VLSI sequential circuits from CAD layout data in the CAD-linked EB test system

  • Author

    Miura, Katsuyoshi ; Nakamae, Koji ; Fujioka, Hiromu

  • Author_Institution
    Fac. of Eng., Osaka Univ., Japan
  • fYear
    1997
  • fDate
    28-31 Jan 1997
  • Firstpage
    329
  • Lastpage
    332
  • Abstract
    A previous hierarchical fault tracing method for combinational circuits which requires only CAD layout data in the CAD-linked electron beam test system is expanded as applicable to sequential circuits. The characteristics in the method remain unchanged that allow us to trace a fault hierarchically from the top level cell to the lowest primitive cell and from the primitive cell to the transistor-level circuit in a consistent manner independently of circuit functions. The applied results of the CAD layouts of some sequential CMOS benchmark circuits show its superiority to the guided-probe method where circuit logical functions are first extracted from the CAD layout data and then the guided-probe testing is executed
  • Keywords
    CMOS logic circuits; VLSI; circuit layout CAD; combinational circuits; electron beam testing; fault diagnosis; integrated circuit design; logic CAD; logic testing; sequential circuits; transistor circuits; CAD layout; CAD-linked EB test system; CAD-linked electron beam test system; VLSI sequential circuits; circuit logical functions; combinational circuits; guided-probe method; hierarchical fault tracing; lowest primitive cell; sequential CMOS benchmark circuits; top level cell; transistor-level circuit; Benchmark testing; CMOS logic circuits; Circuit faults; Circuit testing; Combinational circuits; Electron beams; Sequential analysis; Sequential circuits; System testing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 1997. Proceedings of the ASP-DAC '97 Asia and South Pacific
  • Conference_Location
    Chiba
  • Print_ISBN
    0-7803-3662-3
  • Type

    conf

  • DOI
    10.1109/ASPDAC.1997.600173
  • Filename
    600173