DocumentCode :
3023222
Title :
Coding for jointly optimizing energy and peak current in deep sub-micron VLSI interconnects
Author :
Kim, Eric P. ; Kim, Hun-Seok ; Goel, Manish
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
fYear :
2012
fDate :
20-23 May 2012
Firstpage :
3090
Lastpage :
3093
Abstract :
In deep sub-micron processes, on-chip interconnect is becoming the delay bottleneck and predominant source of power consumption. Simultaneous switching of large buses pose a great challenge on peak current as well. In this paper, we present a novel bus coding technique, based on transition pattern codes (TPC), to perform joint optimization. A TPC scheme has been constructed employing a joint cost function on energy and peak current. The encoder and decoder of the code has been synthesized using a commercial 28nm process and the power, delay and area overhead has been evaluated. HSPICE simulations in 28nm show up to 70% reduction in peak current and 15% reduction in energy consumption compared to an uncoded bus.
Keywords :
VLSI; circuit optimisation; encoding; integrated circuit interconnections; low-power electronics; HSPICE simulations; bus coding; deep sub-micron VLSI interconnects; delay bottleneck; energy consumption; jointly optimizing energy; on-chip interconnect; peak current; power consumption; size 28 nm; transition pattern codes; Cost function; Decoding; Delay; Encoding; Joints; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), 2012 IEEE International Symposium on
Conference_Location :
Seoul
ISSN :
0271-4302
Print_ISBN :
978-1-4673-0218-0
Type :
conf
DOI :
10.1109/ISCAS.2012.6271974
Filename :
6271974
Link To Document :
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