• DocumentCode
    3023378
  • Title

    Scattering effects in Silicon Nanowire Fin field effect transistor

  • Author

    Hamid, F.K.A. ; Webb, Jeffrey F. ; Johari, Zaharah ; Leong, W.S. ; Riyadi, Munawar A. ; Ahmadi, M.T. ; Ismail, Riyad

  • Author_Institution
    Comput. Nanoelectron. Res. Group (CONE), Univ. Teknol. Malaysia (UTM), Skudai, Malaysia
  • fYear
    2012
  • fDate
    19-21 Sept. 2012
  • Firstpage
    86
  • Lastpage
    89
  • Abstract
    The velocity of an electron traveling from the source to drain of a field effect transistor can be much degraded by scattering effects. The scattering effects eventually become dominant as the devices are scaled down to the nanometer regime. In this paper, we propose a current-voltage (I-V) model for a two-dimensional Silicon Nanowire FinFET (SNWFinFET) which considers the scattering mechanism effects as well. Based on our simulated model, a notable scattering effect is observed and the I-V characteristics are in good agreement with experimental data. To evaluate the model, three parameters, temperature, channel length and drain voltage, were varied; the variation of each parameter has a significant effect on the I-V characteristics. These simulation results provide insights helpful for implementing SNWFinFETs as future devices, especially for high speed applications.
  • Keywords
    MOSFET; elemental semiconductors; nanowires; silicon; I-V model; SNWFinFET; Si; channel length; current-voltage model; drain voltage; electron traveling; fin field effect transistor; high speed applications; nanometer regime; scattering mechanism effects; temperature; two-dimensional silicon nanowire FinFET; FinFETs; Logic gates; Mathematical model; Nanoscale devices; Scattering; Silicon; Temperature; FinFET; nanoscale; scaterring effect;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4673-2395-6
  • Electronic_ISBN
    978-1-4673-2394-9
  • Type

    conf

  • DOI
    10.1109/SMElec.2012.6417097
  • Filename
    6417097