Substrate noise suppression technique for power integrity of TSV 3D integration

In this paper, a substrate noise suppression technique is proposed for the power integrity of TSV 3D integrations. This substrate noise suppression technique reduces both substrate and TSV coupling noises using active substrate decouplers (ASDs) to absorb the substrate noise current. Additionally, the ASD placing is also presented to suppress noises effectively for different 3D structures. For a processor-memory stacking integration, the ground bouncing noises can be reduced by 44.1% via the noise suppression technique. The proposed substrate noise suppression technique can enhance the power integrity of TSV 3D-ICs by reducing the coupling substrate noises.