Title :
Effect of copper FAB impact on palladium bond pad
Author :
Sauli, Zaliman ; Retnasamy, Vithyacharan ; Taniselass, Steven ; Norhaimi, W.M.W. ; Aziz, M.H.A. ; Hashim, M.N.
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Alam Pauh Putra, Malaysia
Abstract :
In this study, the initial impact stage of the copper free air ball (FAB) towards the palladium bond pad had been analyzed by using simulation. The effect of copper FAB impact on palladium bond pad was evaluated by simulation using the commercial computational software Ansys. The impact forces of copper FAB were varied from 1N to 5N. The stress response on copper FAB, lead frame and bond pad were obtained at various bond force were. The simulation results showed that when the applied force increases, the stress level on all these three parts increased. Highest stress response was recorded at impact force of 5N.
Keywords :
copper; lead bonding; palladium; Ansys computational software; copper free air ball; impact force; palladium bond pad; stress response; Bonding; Copper; Force; Palladium; Stress; Wires; Copper wire; copper FAB; palladium bond pad;
Conference_Titel :
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4673-2395-6
Electronic_ISBN :
978-1-4673-2394-9
DOI :
10.1109/SMElec.2012.6417149
