Title :
Geometrical characterization of single layer silicon based piezoresistive microcantilever using ANSYS
Author :
Zakaria, M.H. ; Bais, Badariah ; Rahim, R.A. ; Majlis, Burhanuddin Yeop
Author_Institution :
Dept. of Electr. Electron. & Syst. Eng., Univ. Kebangsaan Malaysia (UKM), Bangi, Malaysia
Abstract :
In this paper, characterization on the geometrical aspects of a single layer, p-doped silicon based piezoresistive microcantilever using finite element method is presented. The displacement and the von Mises stress obtained from the simulation were observed by varying the geometries of the microcantilever namely the thickness, length, width and the distance between the piezoresistor legs. The sensitivity of the microcantilever was then calculated and tabulated. From the simulation results, it can be shown that the displacement and sensitivity of the single layer piezoresistive microcantilever is comparable to the dual layer counterpart with the thinner microcantilever resulted in a maximum displacement and sensitivity, compared to other geometrical factors.
Keywords :
cantilevers; electronic engineering computing; elemental semiconductors; finite element analysis; micromechanical devices; piezoresistive devices; resistors; silicon; ANSYS; Si; finite element method; geometrical characterization; piezoresistor legs; single layer p-doped silicon based piezoresistive microcantilever; single layer piezoresistive microcantilever displacement; von Mises stress; Finite element methods; Legged locomotion; Load modeling; Piezoresistance; Sensitivity; Silicon; Stress;
Conference_Titel :
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4673-2395-6
Electronic_ISBN :
978-1-4673-2394-9
DOI :
10.1109/SMElec.2012.6417154