• DocumentCode
    3025281
  • Title

    Teflon bonding of solar cell assemblies using Pilkington CMZ and CMG coverglasses-now a production process

  • Author

    Kitchen, C.A. ; Dollery, A.A. ; Mullaney, K. ; Bogus, K.

  • Author_Institution
    Pilkington Space Technol., Bodelwyddan, UK
  • Volume
    2
  • fYear
    1994
  • fDate
    5-9 Dec 1994
  • Firstpage
    2058
  • Abstract
    Attempts at Teflon bonding have always failed due to the mismatch of thermal coefficients of expansion. With the advent of the Pilkington CMZ and CMG coverglasses where the coefficients have been exactly matched to the solar cell material, the bonding process has been developed so that the advantages and disadvantages of Teflon bonding may be evaluated for use in the space environment. One important advantage is that Teflon lends incorporation of a device which limits the build up of electrical potential on the coverglass. Concepts for ESD protection and automated production assembly processes are given along with flight test results and environmental test programmes
  • Keywords
    adhesion; electrostatic discharge; optical glass; photovoltaic power systems; protection; semiconductor device testing; solar cell arrays; solar cells; space vehicle power plants; ESD protection; Pilkington CMG coverglass; Pilkington CMZ coverglass; Teflon bonding; automated production assembly processes; environmental test programmes; flight test results; production process; solar cell assemblies; space environment; thermal coefficients of expansion; Assembly; Automatic testing; Bonding processes; Electrostatic discharge; Photovoltaic cells; Production; Silicon; Space technology; Thermal expansion; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, 1994., Conference Record of the Twenty Fourth. IEEE Photovoltaic Specialists Conference - 1994, 1994 IEEE First World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    0-7803-1460-3
  • Type

    conf

  • DOI
    10.1109/WCPEC.1994.520775
  • Filename
    520775