Title :
Fabrication and characterization of Cu pellet using Powder Metallurgical method
Author :
Chew Pei Yi ; You Ah Heng ; Raghavan, V.T.
Author_Institution :
Fac. of Eng. & Technol., Multimedia Univ., Jalan Ayer Keroh Lama, Malaysia
Abstract :
Pure Cu is prepared using by Powder Metallurgical (PM) method in order to study the impact of different sintering environment (with vacuum, N2 and N2 + H2) and at different temperatures (1010 °C and 1080 °C) towards its surface and inner morphology, crystal structure and electrical properties. These samples are compacted at a constant pressure of 280 MPa in order to form a pellet with a dimension of 17.7 mm in diameter and about 10-15 mm in height. Cu pellet in vacuum sintering environment is detected with pores in the inner and outer surface of the pellet formed with PM method under SEM. PM method is able to form Cu pellet with electrical conductivity of up to ~ 1.50 × 107 Ω-1 m-1 which is within the electrical conductive range of Cu for lead frame and other electronic applications. This can be further explained through XRD analysis to understand the crystal structure and the SEM results on the grain structure in the Cu pellets.
Keywords :
X-ray diffraction; crystal microstructure; electrical conductivity; hydrogen; nitrogen; powder technology; scanning electron microscopy; sintering; surface morphology; Cu; H2; N2; SEM; X-ray diffraction; XRD analysis; crystal structure; electrical conductivity; grain structure; inner morphology; pellet; powder metallurgical method; pressure 280 MPa; scanning electron microscopy; size 10 mm to 15 mm; size 17.7 mm; surface morphology; temperature 1010 degC; temperature 1080 degC; vacuum sintering environment; Conductivity; Materials; Metals; Powders; Surface morphology; Temperature measurement; X-ray scattering;
Conference_Titel :
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4673-2395-6
Electronic_ISBN :
978-1-4673-2394-9
DOI :
10.1109/SMElec.2012.6417178