DocumentCode
3025628
Title
Fabrication and characterization of surface micromachined CMUT with a bossed membrane
Author
Wang, Mengli ; Chen, Jingkuang ; Cheng, Xiaoyang ; Li, Chuan ; Liu, Xueyuan
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of New Mexico, Albuquerque, NM
fYear
2008
fDate
2-5 Nov. 2008
Firstpage
394
Lastpage
397
Abstract
This paper describes the fabrication and characterization of surface-micromachined capacitive ultrasonic transducers with a bossed membrane. The boss was formed using 3mum-thick deposited tetraethoxysilane (TEOS) oxide on top of a suspended polysilicon membrane. This same oxide layer was also used to seal the release holes along the peripheral of the polysilicon membrane. No extra mask or processing step in addition to that used for fabricating planar-membrane capacitive micromachined ultrasonic transducer (CMUT) is needed for the addition of a boss on the polysilicon membrane. It was found from device characterization that a bossed device shifted the center frequency to a higher value, improved the fractional bandwidth in transmission mode, increased the receiver sensitivity, and augmented the electromechanical coupling efficiency compared to their planar-membrane counterpart with the same membrane diameter.
Keywords
electromechanical effects; micromachining; ultrasonic transducers; bossed membrane; capacitive micromachined ultrasonic transducer; capacitive ultrasonic transducers; electromechanical coupling efficiency; surface micromachined CMUT; suspended polysilicon membrane; tetraethoxysilane oxide; Annealing; Biomembranes; Etching; Fabrication; Micromachining; Seals; Silicon; Ultrasonic imaging; Ultrasonic transducers; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location
Beijing
Print_ISBN
978-1-4244-2428-3
Electronic_ISBN
978-1-4244-2480-1
Type
conf
DOI
10.1109/ULTSYM.2008.0097
Filename
4803574
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