DocumentCode :
3025652
Title :
Failure analysis case studies on open defect
Author :
Song, Gilyoung ; Chunlei Wu ; Yu, Jinpeng ; Gaojie Wen ; Wang, W.
Author_Institution :
Freescale Semicond. (China) Ltd., Tianjin, China
fYear :
2012
fDate :
19-21 Sept. 2012
Firstpage :
495
Lastpage :
498
Abstract :
Failure analysis (FA) plays an important role in the integrated circuit industry. In FA cases, leakage and open are two main types of electrical faults. Optical beam induced resistance change (OBIRCH) technique is a very effective method in locating the leakage related defects or at least pointing out the abnormal leakage current path. But for open related defects, it seems that there is no common and effective method which can identify and locate the defect. In this paper, several open defect related failure analysis cases are presented. Some typical electrical and physical signatures of open fault and some analysis methods are discussed.
Keywords :
failure analysis; FA; OBIRCH technique; electrical faults; electrical signatures; failure analysis case studies; leakage current path; leakage related defects; open fault; open related defects; optical beam induced resistance change technique; physical signatures; Circuit faults; Failure analysis; Flip-flops; Logic gates; MOS devices; Milling; Transient response;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4673-2395-6
Electronic_ISBN :
978-1-4673-2394-9
Type :
conf
DOI :
10.1109/SMElec.2012.6417194
Filename :
6417194
Link To Document :
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