DocumentCode
3025652
Title
Failure analysis case studies on open defect
Author
Song, Gilyoung ; Chunlei Wu ; Yu, Jinpeng ; Gaojie Wen ; Wang, W.
Author_Institution
Freescale Semicond. (China) Ltd., Tianjin, China
fYear
2012
fDate
19-21 Sept. 2012
Firstpage
495
Lastpage
498
Abstract
Failure analysis (FA) plays an important role in the integrated circuit industry. In FA cases, leakage and open are two main types of electrical faults. Optical beam induced resistance change (OBIRCH) technique is a very effective method in locating the leakage related defects or at least pointing out the abnormal leakage current path. But for open related defects, it seems that there is no common and effective method which can identify and locate the defect. In this paper, several open defect related failure analysis cases are presented. Some typical electrical and physical signatures of open fault and some analysis methods are discussed.
Keywords
failure analysis; FA; OBIRCH technique; electrical faults; electrical signatures; failure analysis case studies; leakage current path; leakage related defects; open fault; open related defects; optical beam induced resistance change technique; physical signatures; Circuit faults; Failure analysis; Flip-flops; Logic gates; MOS devices; Milling; Transient response;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4673-2395-6
Electronic_ISBN
978-1-4673-2394-9
Type
conf
DOI
10.1109/SMElec.2012.6417194
Filename
6417194
Link To Document