• DocumentCode
    3025652
  • Title

    Failure analysis case studies on open defect

  • Author

    Song, Gilyoung ; Chunlei Wu ; Yu, Jinpeng ; Gaojie Wen ; Wang, W.

  • Author_Institution
    Freescale Semicond. (China) Ltd., Tianjin, China
  • fYear
    2012
  • fDate
    19-21 Sept. 2012
  • Firstpage
    495
  • Lastpage
    498
  • Abstract
    Failure analysis (FA) plays an important role in the integrated circuit industry. In FA cases, leakage and open are two main types of electrical faults. Optical beam induced resistance change (OBIRCH) technique is a very effective method in locating the leakage related defects or at least pointing out the abnormal leakage current path. But for open related defects, it seems that there is no common and effective method which can identify and locate the defect. In this paper, several open defect related failure analysis cases are presented. Some typical electrical and physical signatures of open fault and some analysis methods are discussed.
  • Keywords
    failure analysis; FA; OBIRCH technique; electrical faults; electrical signatures; failure analysis case studies; leakage current path; leakage related defects; open fault; open related defects; optical beam induced resistance change technique; physical signatures; Circuit faults; Failure analysis; Flip-flops; Logic gates; MOS devices; Milling; Transient response;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4673-2395-6
  • Electronic_ISBN
    978-1-4673-2394-9
  • Type

    conf

  • DOI
    10.1109/SMElec.2012.6417194
  • Filename
    6417194