Title :
Nanomechanical optical devices fabricated with aligned wafer bonding
Author :
Gui, C. ; Veldhuis, G.J. ; Koster, T.M. ; Lambeck, P.V. ; Berenschot, J.W. ; Gardeniers, J.G.E. ; Elwenspoek, M.
Author_Institution :
MESA Res. Inst., Twente Univ., Enschede, Netherlands
Abstract :
This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance
Keywords :
elemental semiconductors; integrated optics; membranes; micromachining; micromechanical devices; optical modulation; polishing; silicon; wafer bonding; Si; Si micromachining; aligned wafer bonding; chemical mechanical polishing; integrated optical nanomechanical devices; intensity modulators; nanomechanical optical devices; phase modulators; stiction; Chemicals; Integrated optics; Intensity modulation; Micromachining; Nanoscale devices; Optical devices; Optical modulation; Phase modulation; Silicon; Wafer bonding;
Conference_Titel :
Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
Conference_Location :
Heidelberg
Print_ISBN :
0-7803-4412-X
DOI :
10.1109/MEMSYS.1998.659805
