DocumentCode :
3025832
Title :
Finite element analysis of stress stiffening effects in CMUTS
Author :
Kupnik, Mario ; Wygant, Ira O. ; Khuri-Yakub, Butrus T.
Author_Institution :
Edward L. Ginzton Lab., Stanford Univ., Stanford, CA
fYear :
2008
fDate :
2-5 Nov. 2008
Firstpage :
487
Lastpage :
490
Abstract :
We use finite element analysis (FEA) to model capacitive micromachined ultrasonic transducer (CMUT) cells where stress stiffening affects static deflection, pull-in voltage, resonance frequency, and small-signal sensitivity. Determining the small-signal sensitivity is challenging because it requires a prestressed harmonic response analysis in which the geometric nonlinearities are activated during the static analysis to prestress the structure. The goal is a correct static operation point calculation for CMUT plates that exceed a static deflection-to-thickness ratio of 20%. Assuming only a small AC excitation, we use a linear but updated stiffness matrix to calculate the harmonic response. We achieve this by using a prestressed mode superposition harmonic response analysis, which uses the sum of factored mode shapes obtained from a nonlinear prestressed modal analysis. We test our FEA for two CMUTs, of which one operates in a more membrane-dominated regime. Comparisons to measurements demonstrate that only the FEA that accounts for stress stiffening features good agreement for both designs. Our FEA allows us to model CMUTs that operate in a more membrane-dominated regime.
Keywords :
acoustic resonance; capacitive sensors; deformation; elastic waves; elasticity; finite element analysis; harmonic analysis; microsensors; ultrasonic transducers; CMUT stress stiffening effects; capacitive micromachined ultrasonic transducer; finite element analysis; geometric nonlinearities; prestressed harmonic response analysis; prestressed mode superposition harmonic response analysis; pull in voltage; resonance frequency; small AC excitation; small signal sensitivity; static deflection-thickness ratio; static operation point calculation; stiffness matrix; Finite element methods; Harmonic analysis; Modal analysis; Resonance; Resonant frequency; Shape; Stress; Testing; Ultrasonic transducers; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2008. IUS 2008. IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2428-3
Electronic_ISBN :
978-1-4244-2480-1
Type :
conf
DOI :
10.1109/ULTSYM.2008.0119
Filename :
4803583
Link To Document :
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