• DocumentCode
    3026360
  • Title

    Lifetime enhancement in EFG multicrystalline silicon [solar cells]

  • Author

    Jeong, J.-W. ; Rohatgi, A. ; Rosenblum, M.D. ; Kalejs, J.P.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    83
  • Lastpage
    86
  • Abstract
    P and Al gettering and SiN-induced hydrogenation of EFG Si have been investigated using manufacturable process techniques. Annealing of SiN coated EFG, without Al on the back, shows very little defect passivation with maximum lifetime enhancement at 700°C. However, annealing of the SiN film, in the presence of Al, significantly increases the defect passivation and moves the optimum temperature to above 800°C. This increase in the optimum temperature is the result of tradeoff between the increase in the release of hydrogen from the SiN film and the decrease in the retention of hydrogen at defects at high temperatures. A higher annealing temperature (>800°C) is desirable because it produces a superior Al-BSF without sacrificing defect passivation. Finally, it is shown that the efficacy of the gettering and hydrogenation process is a strong function of the as-grown lifetime, which dictates the final lifetime as well as cell efficiency
  • Keywords
    annealing; crystal growth from melt; elemental semiconductors; getters; hydrogenation; passivation; semiconductor growth; silicon; solar cells; 700 C; EFG; Si; annealing; annealing temperature; as-grown lifetime; defect passivation; edge-defined film-fed growth; efficiency; gettering; hydrogenation; lifetime enhancement; manufacturable process techniques; multicrystalline Si solar cells; Annealing; Artificial intelligence; Charge carrier lifetime; Costs; Gettering; Hydrogen; Passivation; Photovoltaic cells; Silicon compounds; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE
  • Conference_Location
    Anchorage, AK
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-5772-8
  • Type

    conf

  • DOI
    10.1109/PVSC.2000.915758
  • Filename
    915758