Stress analysis on centric through hole PCB

In this study, the bending process of PCB during depaneling is simulated. The stress response during the bending process is evaluated using a computational program Ansys. Two PCB plate model were developed: One of the model with centric through hole and other model without hole. The stress response of the two models are compared. From the simulation, it has been observed that the value of stress response of the PCB increases with increasing displacement height. The without hole PCB model exhibited a slightly higher stress response compared to the with centric through hole PCB model. Highest stress response for both models were recorded at the displacement height of 5cm.