• DocumentCode
    3026641
  • Title

    An improved P+/N diode leakage current in BiCMOS technologies with fluorine co-implant

  • Author

    Saad, S.Z.M. ; Tan Chan Lik ; Othman, M.A. ; Holger, P. ; Herman, Sukreen Hana

  • Author_Institution
    Technol. Dept., Infineon Technol. (Kulim) Sdn Bhd, Kulim, Malaysia
  • fYear
    2012
  • fDate
    19-21 Sept. 2012
  • Firstpage
    690
  • Lastpage
    693
  • Abstract
    Fluorine (F) is a co-implant species known to have numbers of beneficial effects to the semiconductor device. In this study, we demonstrate the effect of fluorine to the p+/n-junction leakage current improvement in BiCMOS technologies. In which, fluorine and boron fluoride (BF2) were used instead of fluorine-boron (F-B) or BF2 only. By changing the implant sequence at P+ region from F followed by BF2 to BF2 followed by fluorine (BF2-F), the leakage current improved by one decade with a higher breakdown voltage also observed in the reverse sequence, BF2-F.
  • Keywords
    BiCMOS integrated circuits; boron compounds; ion implantation; leakage currents; semiconductor diodes; BF2; BiCMOS technology; P-N diode leakage current; breakdown voltage; fluorine co-implant; implant sequence; reverse sequence; semiconductor device; BiCMOS integrated circuits; Boron; Implants; Junctions; Leakage current; Silicon; Temperature dependence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4673-2395-6
  • Electronic_ISBN
    978-1-4673-2394-9
  • Type

    conf

  • DOI
    10.1109/SMElec.2012.6417237
  • Filename
    6417237