DocumentCode
3026641
Title
An improved P+/N diode leakage current in BiCMOS technologies with fluorine co-implant
Author
Saad, S.Z.M. ; Tan Chan Lik ; Othman, M.A. ; Holger, P. ; Herman, Sukreen Hana
Author_Institution
Technol. Dept., Infineon Technol. (Kulim) Sdn Bhd, Kulim, Malaysia
fYear
2012
fDate
19-21 Sept. 2012
Firstpage
690
Lastpage
693
Abstract
Fluorine (F) is a co-implant species known to have numbers of beneficial effects to the semiconductor device. In this study, we demonstrate the effect of fluorine to the p+/n-junction leakage current improvement in BiCMOS technologies. In which, fluorine and boron fluoride (BF2) were used instead of fluorine-boron (F-B) or BF2 only. By changing the implant sequence at P+ region from F followed by BF2 to BF2 followed by fluorine (BF2-F), the leakage current improved by one decade with a higher breakdown voltage also observed in the reverse sequence, BF2-F.
Keywords
BiCMOS integrated circuits; boron compounds; ion implantation; leakage currents; semiconductor diodes; BF2; BiCMOS technology; P-N diode leakage current; breakdown voltage; fluorine co-implant; implant sequence; reverse sequence; semiconductor device; BiCMOS integrated circuits; Boron; Implants; Junctions; Leakage current; Silicon; Temperature dependence;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
Conference_Location
Kuala Lumpur
Print_ISBN
978-1-4673-2395-6
Electronic_ISBN
978-1-4673-2394-9
Type
conf
DOI
10.1109/SMElec.2012.6417237
Filename
6417237
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