• DocumentCode
    3026972
  • Title

    Influence of post deposition annealing temperatures on electrical properties of Al2O3/InSb MOSCAPs

  • Author

    Hai-Dang Trinh ; Yue-Chin Lin ; Chang, Edward Yi ; Hong-Quan Nguyen ; Shin-Yuan Wang ; Yuen-Yee Wong ; Binh-Tinh Tran ; Quang-Ho Luc ; Chi-Lang Nguyen ; Chang-Fu Dee

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2012
  • fDate
    19-21 Sept. 2012
  • Firstpage
    747
  • Lastpage
    749
  • Abstract
    The influence of post deposition annealing (PDA) temperatures on electrical characteristics of Al2O3/InSb metal-oxide-semiconductor capacitor (MOSCAP) structures is investigated. Low frequency C-V responses with strong inversion behavior in the whole range of measured frequency (100 Hz-1 MHz) are observed, indicating very short minority carrier response time in InSb. The PDA temperature of 300°C and above would result in the reduction of maximum capacitance. At the PDA temperature of above 300°C the C-V hysteresis, frequency dispersion and stretch out increases significantly, indicating the degradation of the MOSCAP structures. The degradation might relate to the interdiffusion between Al2O3 and InSb during thermal steps.
  • Keywords
    III-V semiconductors; MIS structures; MOS capacitors; aluminium compounds; annealing; chemical interdiffusion; indium compounds; minority carriers; Al2O3-InSb; C-V hysteresis; MOSCAP structures; electrical properties; frequency 100 Hz to 1 MHz; frequency dispersion; interdiffusion; low frequency C-V responses; metal-oxide-semiconductor capacitor structures; post deposition annealing temperatures; strong inversion behavior; temperature 300 degC; very short minority carrier response time; Aluminum oxide; Capacitance-voltage characteristics; Degradation; Frequency measurement; Hysteresis; Logic gates; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4673-2395-6
  • Electronic_ISBN
    978-1-4673-2394-9
  • Type

    conf

  • DOI
    10.1109/SMElec.2012.6417251
  • Filename
    6417251