Title :
Packaging Developments For Optoelectronic Components In Broadband Communication Networks
Author_Institution :
BT Laboratories
Keywords :
Backplanes; Broadband communication; Communication networks; Costs; High speed optical techniques; Integrated circuit interconnections; Intelligent networks; Optical fiber devices; Optical interconnections; Packaging;
Conference_Titel :
Integrated Optoelectronics, 1994., Proceedings of IEE/LEOS Summer Topical Meetings:
Print_ISBN :
0-7803-1752-1
DOI :
10.1109/LEOSST.1994.700419