• DocumentCode
    3027050
  • Title

    The parasitic reaction during the MOCVD growth of AlInN material

  • Author

    Wei-Ching Huang ; Yuen-Yee Wong ; Kusan-Shin Liu ; Chi-Feng Hsieh ; Chang, Edward Yi

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2012
  • fDate
    19-21 Sept. 2012
  • Firstpage
    766
  • Lastpage
    768
  • Abstract
    For observation of parasitic reaction effect during InAlN material growth by Metal-Organic Chemical Vapor Deposition (MOCVD), the growth parameters include temperature and pressure had been varied to investigate it. The pressure would be kept at 50torr, 100torr and 150torr and temperature was varied from 700 °C to 780 °C by 20 °C step in each growth pressure. The experimental results appeared that higher pressure gave rise to more serious parasitic reaction during material growth. It made the less Al atoms incorporate into the AllnN. In addition the 100-torr growth pressure shows the best efficiency of Al atom incorporation compare with other two growth pressures. By the AFM analysis, the morphology of Al0.82In0.18N grown with three different pressures was also examined.
  • Keywords
    III-V semiconductors; MOCVD; aluminium compounds; atomic force microscopy; crystal morphology; indium compounds; semiconductor growth; AFM analysis; Al atom incorporation; AlInN; InAlN material growth; MOCVD growth; less Al atoms; metal-organic chemical vapor deposition; morphology; parasitic reaction; pressure 100 torr; pressure 150 torr; pressure 50 torr; Crystals; Gallium nitride; Lattices; MOCVD; Morphology; Surface morphology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2012 10th IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4673-2395-6
  • Electronic_ISBN
    978-1-4673-2394-9
  • Type

    conf

  • DOI
    10.1109/SMElec.2012.6417256
  • Filename
    6417256