• DocumentCode
    3027902
  • Title

    The elastic-viscoplastic field near mode iii dynamic propagating crack-tip of interface in double dissimilar materials

  • Author

    Liang, Wenyan ; Wang, Zhenqing ; Lin, Pengcheng

  • Author_Institution
    Smart Struct. & Adv. Composites Lab., Harbin Eng. Univ., Harbin, China
  • fYear
    2010
  • fDate
    8-10 June 2010
  • Firstpage
    1242
  • Lastpage
    1245
  • Abstract
    The existence of viscosity effect at the interface of double dissimilar materials has an important impact to the distribution of interface crack-tip field and the properties variety of the interface itself. The singular is considered in crack-tip, and the elastic-viscoplastic quasi-static propagating governing equations of double dissimilar materials at interface crack-tip field are established. The displacement potential function and boundary condition of interface crack-tip are introduced and the numerical analysis of rigid-elastic viscoplastic interface for mode III are worked out. The stress-strain fields are obtained at the crack-tip and the variations of solutions are discussed according to each parameter. The numerical results show that the viscosity effect is a main factor of interface propagating crack-tip field, and the interface crack-tip is a viscoplastic field that is governed by viscosity coefficient, Mach number and singular factor.
  • Keywords
    composite materials; cracks; elastoplasticity; stress-strain relations; viscoplasticity; viscosity; Mach number; boundary condition; displacement potential function; double dissimilar material; elastic-viscoplastic field; interface crack-tip field; mode III dynamic propagating crack-tip; rigid-elastic viscoplastic interface; singular factor; stress-strain field; viscosity coefficient; viscosity effect; Equations; Mathematical model; Plastics; Strain; Stress; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems and Control in Aeronautics and Astronautics (ISSCAA), 2010 3rd International Symposium on
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-6043-4
  • Electronic_ISBN
    978-1-4244-7505-6
  • Type

    conf

  • DOI
    10.1109/ISSCAA.2010.5632307
  • Filename
    5632307