Title :
Data Management: The Spirit to Pursuit Peak Performance on Many-Core Processor
Author :
Zhou, Yongbin ; Zhang, Junchao ; Zhang, Shuai ; Yuan, Nan ; Fan, Dongrui
Author_Institution :
Key Lab. of Comput. Syst. & Archit., Chinese Acad. of Sci., Beijing, China
Abstract :
To date, most of many-core prototypes employ tiled topologies connected through on-chip networks. The throughput and latency of the on-chip networks usually become to the bottleneck to achieve peak performance especially for communication intensive applications. Most of studies are focus on on-chip networks only, such as routing algorithms or router micro-architecture, to improve the above metrics. The salient aspect of our approach is that we provide a data management framework to implement high efficient on-chip traffic based on overall many-core system. The major contributions of this paper include that: (1) providing a novel tiled many-core architecture which supports software controlled on-chip data storage and movement management; (2) identifying that the asynchronous bulk data transfer mechanism is an effective method to tolerant the latency of 2-D mesh on-chip networks. At last, we evaluate the 1-D FFT algorithm on the framework and the performance achieves 47.6 Gflops with 24.8% computation efficiency.
Keywords :
computer architecture; fast Fourier transforms; microprocessor chips; network topology; storage management; 1D FFT algorithm; 2D mesh on-chip networks; asynchronous bulk data transfer mechanism; data management framework; fast Fourier transform; many-core processor; router micro-architecture; routing algorithms; software controlled on-chip data storage; tiled many-core architecture; tiled topologies; Communication system traffic control; Computer architecture; Delay; Memory; Network topology; Network-on-a-chip; Prototypes; Routing; System-on-a-chip; Throughput; 1-D FFT; Many-core; Scratchpad memory; asynchronous data transfer;
Conference_Titel :
Parallel and Distributed Processing with Applications, 2009 IEEE International Symposium on
Conference_Location :
Chengdu
Print_ISBN :
978-0-7695-3747-4
DOI :
10.1109/ISPA.2009.22