DocumentCode :
3029606
Title :
Study on the Thermal-Humidity Reliability of High Power LED Module
Author :
Kailin Pan ; Jing Huang ; Yu Guo ; Renzhang Chen
Author_Institution :
Sch. of Mech. & Electr. Eng., Guilin Univ. of Electron. Technol., Guilin, China
fYear :
2013
fDate :
29-30 June 2013
Firstpage :
1331
Lastpage :
1334
Abstract :
LED lighting becomes the forth generation green lighting. However, in terms of LED development and large-scale application, the reliability of LED has become one of the technical bottlenecks. This paper carried out the research on the thermal-humidity reliability of high power LED module by the means of experiment and simulation, which mainly aims at the reliability problems existed in high power LED products. Thermal-humidity experiments which takes high power LED module with 10W as the experimental sample and simulation analysis based on FEM (Finite Element Method) software ANSYS are carried out. The results show that, high temperature is the main factor which affects the thermal-humidity reliability of high power LED module.
Keywords :
finite element analysis; humidity; light emitting diodes; lighting; reliability; FEM software ANSYS; LED lighting; finite element method; forth generation green lighting; high power LED module; power 10 W; thermal-humidity reliability; Finite element analysis; Humidity; Light emitting diodes; Reliability; Stress; Temperature distribution; Thermal stresses; led module; thermal- humidity simulation; thermal-humidity reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Digital Manufacturing and Automation (ICDMA), 2013 Fourth International Conference on
Conference_Location :
Qingdao
Type :
conf
DOI :
10.1109/ICDMA.2013.317
Filename :
6598241
Link To Document :
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