Title :
Fully packaged CMOS current monitor using lead-on-chip technology
Author :
Steiner, R. ; Schneider, M. ; Mayer, F. ; Münch, U. ; Mayer, M. ; Baltes, H.
Author_Institution :
Lab. fur Phys. Electron., Eidgenossische Tech. Hochschule, Zurich, Switzerland
Abstract :
A compact CMOS monitor system for galvanically isolated current measurement is presented. It is packaged with standard lead-on-chip technology and completely in line with commercial IC production. This technology includes inexpensive and high volume batch fabrication of chips followed by automatic mass packaging. The system has a linear response in a range of ±10 A with a small non-linearity below ±0.3%. This results in a measurement accuracy of better than 50 mA. The accuracy is further improved by soft ferromagnetic field concentrators
Keywords :
CMOS integrated circuits; electric current measurement; integrated circuit packaging; lead bonding; magnetic sensors; CMOS current monitor; IC production; automatic mass packaging; batch fabrication; galvanically isolated current measurement; lead-on-chip technology; linear response; measurement accuracy; nonlinearity; soft ferromagnetic field concentrators; standard lead-on-chip technology; Bonding; CMOS technology; Electronics packaging; Galvanizing; Integrated circuit packaging; Lab-on-a-chip; Magnetic sensors; Monitoring; Production; Space technology;
Conference_Titel :
Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop on
Conference_Location :
Heidelberg
Print_ISBN :
0-7803-4412-X
DOI :
10.1109/MEMSYS.1998.659826
