A design and implementation methodology for micromachining

Author

Tait, R.N. ; Landsberger, L.M. ; Currie, J.F. ; McKinnon, G.H. ; Parameswaran, M. ; Robinson, A.M. ; Gale, D.J.

Author_Institution

Alberta Microelectron. Centre, Edmonton, Alta., Canada

Volume

1

fYear

1996

fDate

26-29 May 1996

Firstpage

72

Abstract

The use of standard CMOS processes for micromachining has certain limitations, such as the incompatibility of aluminum bonding pads with the most popular silicon etchants, and the difficulty of obtaining backside patterns on individual die. To overcome these limitations, the Canadian Microelectronics Corporation is developing the Can-MEMS post-processing service, leveraging equipment and expertise at various institutions in Canada. Using a distributed lab to post-process wafers from a CMOS foundry, several features are being offered: (i) a third metal layer (platinum); (ii) a silicon nitride passivation layer; (iii) backside patterning; (iv) anisotropic wet etching of silicon. Design rules for use with these new features have been developed

Keywords

CMOS integrated circuits; elemental semiconductors; etching; micromachining; micromechanical devices; passivation; silicon; CMOS foundry; Can-MEMS post-processing service; MEMS; Si; anisotropic wet etching; backside patterning; design rules; microelectromechanical devices; micromachining; passivation layer; wafer post-processing; Aluminum; CMOS process; Design methodology; Etching; Foundries; Microelectronics; Micromachining; Platinum; Silicon; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical and Computer Engineering, 1996. Canadian Conference on

Conference_Location

Calgary, Alta.

ISSN

0840-7789

Print_ISBN

0-7803-3143-5

Type

conf

DOI

10.1109/CCECE.1996.548041

Filename

548041