DocumentCode
3030327
Title
Multi-walled carbon nanotube impedance
Author
Madadi, Iman ; Aghababa, Hossein ; Forouzandeh, Behjat
Author_Institution
Sch. of Electr. & Comput. Eng., Univ. of Tehran, Tehran, Iran
fYear
2010
fDate
2-4 June 2010
Firstpage
198
Lastpage
202
Abstract
In future technologies, people will confront with traditional Cu interconnect problems and there is a widespread demand for single-walled carbon nanotube (SWCNT) and multi-walled carbon nanotube (MWCNT). One of the most important parts in carbon nanotube interconnects is their impedance. Thus we investigate impedance, especially dc resistance, in multi walled carbon nano tube interconnect in low and high bias voltages for different geometries. The total dc resistance of an MWCNT is then calculated and an equation was obtained. We have also investigated the behavior of MWCNTs, in both low and high damping modes, in high bias regime. The results for delay and power showed better performance for MWCNT´s interconnect compared to those for Cu´s.
Keywords
carbon nanotubes; copper; electric resistance; Cu interconnect; DC resistance; MWCNT; carbon nanotube interconnects; damping mode; multiwalled carbon nanotube impedance; Carbon nanotubes; Copper; Damping; Delay; Equations; Geometry; Impedance; Integrated circuit interconnections; Temperature; Voltage; Carbon nanotube (CNT); circuit model; interconnect; multi-walled CNT (MWCNT); signal delay; single-walled CNT (SWCNT);
fLanguage
English
Publisher
ieee
Conference_Titel
IC Design and Technology (ICICDT), 2010 IEEE International Conference on
Conference_Location
Grenoble
Print_ISBN
978-1-4244-5773-1
Type
conf
DOI
10.1109/ICICDT.2010.5510254
Filename
5510254
Link To Document