Title :
Absorber layers for n+n-p+ μc-Si solar cells grown by electron cyclotron resonance (ECR) CVD
Author :
Birkholz, M. ; Conrad, E. ; Elstner, L. ; Müller, P.
Author_Institution :
Hahn-Meitner-Inst., Berlin, Germany
Abstract :
Thin film n+n-p+ solar cells of microcrystalline silicon were deposited by a combination of different chemical vapor depositions, i.e. plasma-enhanced CVD (PECVD), rapid thermal chemical vapor deposition (RTCVD) and electron cyclotron resonance CVD (ECRCVD). The preparation of the 1.5-2 μm thick absorber layer has been carried out by ECRCVD, which was optimized before with respect to the crystallinity of the material and the reduction of contaminants. Dark conductivities in the range of 10-7 Ω-1 cm-1 were finally obtained for nominally undoped (n-) μc-Si films on glass. The deposition of n+ and p+ doped films was performed by common 13.56 MHz PECVD or in the case of n+ films by RTCVD, too. Solar cells of 1 cm2 were obtained by mesa etching and lift-off grid metallization. The cells prepared by these techniques achieved an open-circuit voltage of 374 mV and an efficiency of up to 1.6 % without any optical confinement
Keywords :
CVD coatings; chemical vapour deposition; cyclotron resonance; electrical conductivity; elemental semiconductors; etching; metallisation; semiconductor growth; semiconductor thin films; silicon; solar cells; 1.5 to 2 mum; 1.6 percent; 13.56 MHz; 374 mV; ECRCVD; PECVD; RTCVD; Si; absorber layers; chemical vapor deposition; contaminants reduction; crystallinity; dark conductivities; efficiency; electron cyclotron resonance CVD; lift-off grid metallization; mesa etching; microcrystalline silicon; n+n-p+ μc-Si solar cells; nominally undoped μc-Si films; open-circuit voltage; plasma-enhanced CVD; rapid thermal chemical vapor deposition; Chemical vapor deposition; Electrons; Optical films; Photovoltaic cells; Plasma applications; Plasma chemistry; Plasma materials processing; Semiconductor thin films; Silicon; Sputtering;
Conference_Titel :
Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE
Conference_Location :
Anchorage, AK
Print_ISBN :
0-7803-5772-8
DOI :
10.1109/PVSC.2000.916030