• DocumentCode
    3031057
  • Title

    Deposition of amorphous silicon solar cells via the pulsed PECVD technique

  • Author

    Morrison, Scott ; Madan, Arun

  • Author_Institution
    MVSyst. Inc., Golden, CO, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    928
  • Lastpage
    931
  • Abstract
    The pulsed plasma CVD technique has been shown to increase the deposition rate without an increase in the particulate count in the plasma, which is an important factor in determining the yield of commercial products such as solar cell modules. In this paper, the authors report on the use of this technique in a small area deposition system, and show deposition rates of a-Si:H of up to 15 Angstroms/sec can be achieved using a modulation frequency in the range of 1-100 kHz. Simple solar cells of the p/i/n configuration, deposited using this technique, have shown initial efficiencies of 9% with intrinsic-layer deposition rates of up to 7 A/sec. The application of this technique to a large-area 30 cm×40 cm system is also discussed. In particular, they report a deposition rate of rate(>25%), and the performance of small area (0.25 cm2) devices using this approach
  • Keywords
    amorphous semiconductors; elemental semiconductors; hydrogen; plasma CVD; plasma CVD coatings; semiconductor doping; semiconductor thin films; silicon; solar cells; 1 to 100 kHz; 30 cm; 40 cm; 9 percent; Si:H; a-Si:H solar cells; commercial product yield; deposition rate; intrinsic-layer; modulation frequency; p/i/n configuration; pulsed plasma CVD technique; small area deposition system; Amorphous silicon; Optical materials; Photoconducting materials; Photoconductivity; Photovoltaic cells; Plasma applications; Plasma materials processing; Plasma properties; Radio frequency; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2000. Conference Record of the Twenty-Eighth IEEE
  • Conference_Location
    Anchorage, AK
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-5772-8
  • Type

    conf

  • DOI
    10.1109/PVSC.2000.916036
  • Filename
    916036