• DocumentCode
    3031831
  • Title

    IC test using the energy consumption ratio

  • Author

    Jiang, Wanli ; Vinnakota, Bapiraju

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    976
  • Lastpage
    981
  • Abstract
    Dynamic-current based test techniques can potentially address the drawbacks of traditional and Iddq test methodologies. The quality of dynamic current based test is degraded by process variations in IC manufacture. The energy consumption ratio (ECR) is a new metric that improves the effectiveness of dynamic current test by reducing the impact of process variations by an order of magnitude. We address several issues of significant practical importance to an ECR-based test methodology. We use the ECR to test a low-voltage submicron IC with a microprocessor core. The ECR more than doubles the effectiveness of the dynamic current test already used to test the IC. The fault coverage of the ECR is greater than that offered by any other test, including Iddq. We develop a logic-level fault simulation tool for the ECR and techniques to set the threshold for an ECR-based test process. Our results demonstrate that the ECR offers the potential to be a high-quality low-cost test methodology. To the best of our knowledge, this is the first dynamic-current based test technique to be validated with manufactured ICs
  • Keywords
    fault simulation; integrated circuit testing; logic testing; IC manufacture; IC testing; dynamic current based test; energy consumption ratio; fault coverage; logic-level fault simulation tool; low-voltage submicron IC; microprocessor core; process variations; test methodology; Circuit faults; Circuit simulation; Circuit testing; Current supplies; Degradation; Energy consumption; Integrated circuit testing; Logic testing; Microprocessors; Monitoring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 1999. Proceedings. 36th
  • Conference_Location
    New Orleans, LA
  • Print_ISBN
    1-58113-092-9
  • Type

    conf

  • DOI
    10.1109/DAC.1999.782238
  • Filename
    782238