High resolution photo-patterning on large area substrates

Author

Müller, Heinrich G. ; Sheets, Ronald E.

Author_Institution

Tamarack Sci., Armando St. CA, USA

fYear

1994

fDate

12-14 Sep 1994

Firstpage

195

Abstract

A new type of photolithography system is presented. The method of scanning projection exposure is a cost effective way to pattern large area substrates with sufficient resolution for MCMs, super fine line PCBs, or thin film displays. The substrate is patterned with an erected 1:1 projection image of the mask. The exposure is performed on a small exposure field only. Scanning substrate and mask together below the exposure field results in a high resolution exposure of the entire substrate without need for the stitching operations of a step-and-repeat system, and without the mask deterioration problems of contact/proximity exposure

Keywords

focusing; integrated circuit technology; multichip modules; photolithography; printed circuit manufacture; thin film circuits; MCMs; high resolution photo-patterning; large area substrates; mask; photolithography system; scanning projection exposure; super fine line PCBs; thin film displays; Costs; Displays; Lithography; Optical collimators; Optical distortion; Optical interferometry; Printing; Stray light; Substrates; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International

Conference_Location

La Jolla, CA

Print_ISBN

0-7803-2037-9

Type

conf

DOI

10.1109/IEMT.1994.404667

Filename

404667